A Taiwan Conflict Is Not the Samsung Foundry Case. The Packaging Queue Is.
TSMC’s Form 20-F for the 2025 fiscal year states that most of its production facilities are in Taiwan, and names the outbreak of military conflict, war or hostilities in its risk factors. That is TSMC describing its own exposure in a document it signs. The nearer constraint is dateable and already running: on its 16 July earnings call TSMC said advanced packaging capacity was tight enough to limit customer growth, and that it would welcome competing packaging technology taking some of the load. Samsung Electronics is the one company outside Taiwan that has told the market in its own release that it is winning leading-edge work now, disclosing expanding 2nm design wins for high-performance computing on 30 July. Packaging is not wafer allocation and a design win is not a shipment, so we say what each document does and does not carry. Four claims that travel with this story, including the Taylor capacity figures and a prospective Google allocation, are named and withheld because no body publishes them under its own name.